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MIJING 3D BGA REBALL STENCIL FOR IPHONE 6/6P/6S/6SP/7/7P/8/8P/X/XS/XSMAX/XR/11/11PRO/11PROMAX

MIJING 3D BGA REBALL STENCIL FOR IPHONE 6/6P/6S/6SP/7/7P/8/8P/X/XS/XSMAX/XR/11/11PRO/11PROMAX

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MIJING 3D BGA REBALL STENCIL FOR IPHONE 6/6P/6S/6SP/7/7P/8/8P/X/XS/XSMAX/XR/11/11PRO/11PROMAX

0.025mm thickness
3D BGA for A8 6 6P A9 6S 6SP A10 7 7P
It is 3D.
A8 contains all 6 6P BGA
A9 contains all 6s 6sP
A10 contains all 7 7P

A11 contains all 8 8P X 

Feature:

• Stepped groove design enables stencil to align with tinning position of ic rapidly.
• The square holes design makes it easier to take out the formed solder balls.
• This 3D stencil is easy to use no matter you are a new or expert.
• High success rate of planting tin,the solder balls can be formed once afer you are proficient.
• This 3D planting stencil is thicker than ordinary stencils in the market.Less tendency of deformation makes its using life be longer.